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Heavyweight release (sixth quarter): list of 1 billion clubs in China's component distribution in 2020!

发布时间:2021-12-31作者来源:金航标浏览:1850

On March 31, 2021, with the attention and support of distribution colleagues and 1 billion club enterprises, chip master Research Institute officially released (sixth quarter) [list of 1 billion club for component distribution in China in 2020].

On March 31, 2021, with the attention and support of distribution colleagues and 1 billion club enterprises, chip master Research Institute officially released (sixth quarter) [list of 1 billion club for component distribution in China in 2020].



1、Who did the distributor test the original factory?


In 2020, the impact of capital on traditional distributionAttention continues to decline, secondary market of Listed EnterprisesMarket value continued to decline, traditional distributors have arrivedtenWord intersectionIt also forces distributors to seek changes upstream. This restless agitation and water test, exceptVoice and controlDisputes, andPorter identity and fish and water feelingsGame. Whose fault is this?


In this case, some distributors have completed the gorgeous turn,Weir sharesBecome an original distribution enterprise with a market value of 100 billion,Yingtang intelligent controlAcquisition of Japanese pioneer,Yachuang ElectronicsAcquisition of power management IC business of tamul, Korea,Shenzhen HuaqiangShares in BYD semiconductor, etc.


2. Historical market and shortage


Benefiting from the surge in domestic procurement of consumer electronic products, the component distribution industry maintained relatively strong demand in the first five months, and the overall market was flat with the same period in 2019. Since June, IC has entered the channel of capacity shortage and price rise, and the upstream from September to DecemberManufacturing costs are high and rising, the average transaction price and shipment volume in the distribution market are rising, and the quarterly performance of many agents has reached record highsBest in historyAnd refreshed the annual growth data in one fell swoop.


At the same time, distribution channelsInventory levelIt has dropped to the lowest level of this year, and the difficulty and cost of getting goods from the upstream at the end of the year have increased significantly.


Unprecedented marketBehind it are historical shortages, insufficient production capacity and speculationUnprecedented supply chain crisisBrewing.


3、Domestic agent & product line force


If 2019 is the "first year" for the localization of components, then the COVID-19 coming in at the end of 2020 will really enter.fast lane


In the first half of the year, with the help of the domestic "housing economy" and the electronic demand generated by epidemic prevention and control, consumer and medical devices broke out,Domestic manufacturers and agentsHe has become a hero behind the scenes in preventing and controlling domestic epidemics and exporting a large number of anti epidemic equipment to the world.


In the second half of the year, driven by the success of domestic anti epidemic and the blowout of consumer demand,Domestic MCU, power IC, etcThe product line is fully started. The contribution of agent channels and domestic brand agent lines has risen sharply. Although domestic chips account for only5%However, the original factory and agents have entered a rare stage"Honeymoon period"


4. Component e-commerce: getting better


2020China component E-commerceWith the help of capital and its own "butterfly change", there have been two significant changes.


everythingE-commerce PCB / SMTTrack integration is becoming standard. Due to the inherent dependence of components on PCB and SMT links, the component e-commerce enterprises entering the market from all outlets are no longer satisfied with the channels, or go to the sea in person, or combine vertically and horizontally. They have "cross-border" integrated upstream manufacturing resources and entered Kangzhuang avenue to create a real "one-stop" industrial chain service, and the competition has further upgraded.


The second iscapitalIt continues to increase its weight, and the industrial scale and prospect continue to be optimistic. According to incomplete statistics of chip master Research Institute, as of press time, since 2011, 17 B2B enterprises for component distribution in the domestic primary market have disclosed financing data, with a total of 37 cases, and the cumulative financing amount has exceeded4 billion yuan


Not only attractedSequoia, Gaoling, Shunwei, Shenzhen Venture Capital, ZhongdingSuch first-line capital is more importantAli business, JD industrial productsAfter entering the market, component e-commerce has shown unprecedented attention and potential, and the IPO road of Chinese component e-commerce is about to open.



epilogue


Trade, industry and technology”And“Technology, industry and tradeThe confusion is also reflected in the values of distributors. “Bigger and stronger”In, bigger and Porter labels are no longer the first choice for enterprises. Becoming stronger has gradually become the consensus of all parties, especially the extension and innovation to the industrial chain, which has become a hot option for capital pursuit.



statement


Data source:1. The data of listed companies comes from performance pre disclosure and express report; 2. The data of unlisted companies are partly from voluntary disclosure and partly from the original factory and third-party evidence; 3. Other data are derived from historical data inference.


Important note:Due to different statistical standards, the list is controversial. Please understand and put forward improvement opinions and suggestions for subsequent revision by chip masters; If you have any objection to the list, please leave a message and communicate with us; This list does not constitute any investment advice.

This article comes from“Wu Bo”Author, if you have any questions about infringement, please contact us to deleteSupport the protection of intellectual property rights. Please indicate the original source and author for reprint.

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